encapsulating material meaning in Chinese
封包材料
灌封材料
Examples
- Based on the over research , three different kinds of encapsulating materials of epoxy resin are performed
在各种不同制备方法研究的基础上，选用不同的改性体系制备出环氧灌封材料，并对其性能作了评价。 - There are some differences between simulation and experiment results in the patterns " distribution scale for there are still some conditions " differences just as characteristics of encapsulated materials and shapes of encapsulated structure
Led结构的参数变化时，模拟曲线的变化趋势与实验情况吻合较好。其中存在的不同和误差必需根据led管型的真实参数适当调整模拟参数和条件解决，有待进一步改进。 - In this paper the situation and development of electronic packaging and its requirments for the encapsulate materials in high properties were introduced and a novel kind alicyclic epoxy for electronic packaging was also reviewed with 13 refs
摘要结合电子封装的现状、电子塑封材料的发展以及电子封装对塑封材料提出的高性能要求，介绍了新型脂环族环氧树脂及其作为塑封材料的应用前景，其包括耐热型液体、含磷三官能团型、有机硅多官能团脂环族环氧树脂。 - Encapsulating materials of epoxy resin are modified with hgh , nano - sio2 and organophilic montmorillonite , in the present investigation , the microstructue , some properties and influence factors about nano - sio2 and organophilic montmorillonite modified encapsulatig materials have been systematically studied using x - ray diffraction , electron microscopy and differential thermal analysis measurement techniques
随着航空、电子等事业的发展，灌封器件的高性能化对灌封材料提出了越来越高的要求。探索制备环氧灌封材料的新方法，寻求提高其使用性能的有效途径是该领域研究的重要课题。 - This paper mainly described the research on rheological property , high thermal stability , flame retardant , the influence of catalyst and insulating heat conduction of organic silicon encapsulating materials , which greatly apply on electronic equipment and large scale integrated circuit and so forth
摘要本文主要综述了国内外用于电子元器件、大规模集成电路等高科技领域的有机硅灌封材料在流动、耐高温、阻燃和绝缘导热等方面的性能以及催化剂对灌封材料的影响的研究应用进展。